Plated Copper Nozzle

 
6

Hardness (Mohs)


500

Maximum Printing Temperature


330W/m·k

Thermal Conductivity


16.7μm/m·℃

Expansion Coefficient



 
In the process of 3D printing, PEEK, PEKK, PEI, PSU, PPSU and other filaments whose temperature is above 300℃ can be melted are called high-temperature filaments.The ordinary brass nozzle cannot complete its printing.The thermal conductivity of the nozzle made of copper alloy is 330W/m.k, and the maximum printing temperature can reach 500℃, which can solve the problem of rapid heating of high-temperature filaments and continuous printing, effectively extending the service life of the nozzle.
Temperature resistance up to 500℃, the best choice for special engineering plastics such as PEEK.
High thermal performance keeps an even temperature of nozzle tip during printing, thus guaranteeing a stable extrusion; Meanwhile, further improves printing speed without sacrificing the quality.
Special processing technology and post-treatment make the nozzle without burr at the edge of tip and without debris in the hole.
Inner hole roughness lower than Ra0.4 and the whole nozzle nickel plated, Enhanced higher smoothness and less adhesion.
Superior quality copper alloy with high strength and high thermal conductivity ensures the stability of performance.
1100-PS-PC
1200-PS-PC
1110-PH-PC
175:Φ0.25/Φ0.30/Φ0.35/Φ0.40/Φ0.50/Φ0.60/Φ0.80/Φ1.00
300:Φ0.25/Φ0.30/Φ0.35/Φ0.40/Φ0.50/Φ0.60/Φ0.80/Φ1.00

Temperature resistance up to 500℃, the best choice for special engineering plastics such as PEEK.
High thermal performance keeps an even temperature of nozzle tip during printing, thus guaranteeing a stable extrusion; Meanwhile, further improves printing speed without sacrificing the quality.
Special processing technology and post-treatment make the nozzle without burr at the edge of tip and without debris in the hole.
Inner hole roughness lower than Ra0.4 and the whole nozzle nickel plated, Enhanced higher smoothness and less adhesion.
Superior quality copper alloy with high strength and high thermal conductivity ensures the stability of performance.

High temperature performance, working well for high temperature applications, printing with materials such as PEEK, PEKK, PEI, PSU, PPSU and etc.


Min. Orifice Diameter
φ0.10

Tolerance
±0.01mm

Inner Hole Roughness
≤Ra0.4μm

Concentricity
≤0.02mm